Single sided to 20 layers printed wiring board manufacturing in China

Rigid printed wiring board Technical Capabilities
Item Manufacture Capability
Layers 1-20L
Material Types FR-1, FR-4, CEM-1, CEM-3, IMS, High TG，
High Frequency, Halogen Free,
Aluminum base, metal core base
Max.Panel Dimension 546mm*622mm
Outline Tolerance ±0.10mm
Board Thickness 0.20mm-5.0mm
Board thickness Tolerance(t=0.8mm) ±8%
Min. Mechanical Drill Hole Size 0.15mm
Min. Laser Drill Hole Size 0.075mm
Min.track Width 0.0635mm(2.5mil)
Min.track Gap 0.0635mm(2.5mil)
Surface treatment HASL(LF), Flash gold, ENIG,OSP
(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin,
Gold finger plating,
ENIG+ Gold finger
External Cu.Thickness 35um-210um(1oz-6oz)
Internal Cu.Thickness 17um-175um(0.5oz-5oz)
Drilling Bit Size(CNC) 0.10mm-5.95mm
Finished Hole Dimension(CNC) 0.20mm-6.0mm
Hole Tolerance(CNC) ±0.075mm/±0.05mm
Hole Postion Tolerance(CNC) ±0.05mm
Board Thickness : Min.Hole Dimension 8:1
Performance Test 100% electrical and electricity
performance test
Solder Mask LPI, green, black, white,
red, blue, yellow
Min Solder Mask Bridge 0.0635mm
Thermal Shock Test 288℃，10S，3X
Impedance Control Tolerance ±5%